{"number":"US12697671B2","kindCode":"B2","documentType":"grant","title":{"original":"Solder reflow apparatus and method of manufacturing an electronic device","english":"Solder reflow apparatus and method of manufacturing an electronic device"},"abstract":{"original":"An apparatus includes: a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated by the heat transfer fluid; a heater configured to heat the heat transfer fluid in the vapor generating chamber; a substrate stage configured to be movable upward or downward in the vapor generating chamber and to support a substrate on which an electronic device is mounted via a solder. The apparatus also includes at least one mesh plate extending in a horizontal direction in the vapor generating chamber.…","english":"An apparatus includes: a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated by the heat transfer fluid; a heater configured to heat the heat transfer fluid in the vapor generating chamber; a substrate stage configured to be movable upward or downward in the vapor generating chamber and to support a substrate on which an electronic device is mounted via a solder. The apparatus also includes at least one mesh plate extending in a horizontal direction in the vapor generating chamber.…"},"applicants":["SAMSUNG ELECTRONICS CO., LTD."],"inventors":["Junga LEE","Youngja Kim","Hyunki Kim","Youngmin Lee"],"filingDate":"2025-01-17","publicationDate":"2026-08-04","grantDate":"2026-08-04","verifiedWithOffice":true,"pdfUrl":"https://downloadpatent.com/pdf/US12697671B2.pdf","pages":{"en":"https://downloadpatent.com/patent/US12697671B2","zh-Hant":"https://downloadpatent.com/zh-Hant/patent/US12697671B2","ja":"https://downloadpatent.com/ja/patent/US12697671B2"}}