{"number":"US12697688B2","kindCode":"B2","documentType":"grant","title":{"original":"Semiconductor device manufacturing apparatus and manufacturing method","english":"Semiconductor device manufacturing apparatus and manufacturing method"},"abstract":{"original":"A semiconductor device manufacturing device comprises: a stage; two bonding heads which are mutually independently horizontally movable; and a controller for causing each of the two bonding heads to perform a positioning process for horizontal positioning, a grounding process for lowering the chip until the chip is grounded on a substrate, and a pressurizing process for applying a bonding load to the chip that is grounded.…","english":"A semiconductor device manufacturing device comprises: a stage; two bonding heads which are mutually independently horizontally movable; and a controller for causing each of the two bonding heads to perform a positioning process for horizontal positioning, a grounding process for lowering the chip until the chip is grounded on a substrate, and a pressurizing process for applying a bonding load to the chip that is grounded.…"},"applicants":["Yamaha Robotics Co., Ltd."],"inventors":["Kohei SEYAMA","Makoto TAKAHASHI"],"filingDate":"2023-03-01","publicationDate":"2026-08-04","grantDate":"2026-08-04","verifiedWithOffice":true,"pdfUrl":"https://downloadpatent.com/pdf/US12697688B2.pdf","pages":{"en":"https://downloadpatent.com/patent/US12697688B2","zh-Hant":"https://downloadpatent.com/zh-Hant/patent/US12697688B2","ja":"https://downloadpatent.com/ja/patent/US12697688B2"}}