{"number":"US12697719B2","kindCode":"B2","documentType":"grant","title":{"original":"Process kit alignment method for improving semiconductor yield","english":"Process kit alignment method for improving semiconductor yield"},"abstract":{"original":"A method includes causing an upper process kit ring to be removed from a lower process kit ring. The method further includes, responsive to causing the upper process kit ring to be removed from the lower process kit ring, causing, based on sensor data, a first position correction associated with the lower process kit ring. The method further includes, responsive to the first position correction, causing the upper process kit ring to be disposed on the lower process kit ring.","english":"A method includes causing an upper process kit ring to be removed from a lower process kit ring. The method further includes, responsive to causing the upper process kit ring to be removed from the lower process kit ring, causing, based on sensor data, a first position correction associated with the lower process kit ring. The method further includes, responsive to the first position correction, causing the upper process kit ring to be disposed on the lower process kit ring."},"applicants":["Applied Materials, Inc."],"inventors":["Damon K. Cox","Ali Utku Pehlivan","Paul Benjamin Reuter"],"filingDate":"2023-09-11","publicationDate":"2026-08-04","grantDate":"2026-08-04","verifiedWithOffice":true,"pdfUrl":"https://downloadpatent.com/pdf/US12697719B2.pdf","pages":{"en":"https://downloadpatent.com/patent/US12697719B2","zh-Hant":"https://downloadpatent.com/zh-Hant/patent/US12697719B2","ja":"https://downloadpatent.com/ja/patent/US12697719B2"}}