{"number":"US12697753B2","kindCode":"B2","documentType":"grant","title":{"original":"Sound-assisted crack propagation for semiconductor wafering","english":"Sound-assisted crack propagation for semiconductor wafering"},"abstract":{"original":"Systems and methods are described for controlled crack propagation in a material using ultrasonic waves. A first stress in applied to the material such that the first stress is below a critical point of the material and is insufficient to initiate cracking of the material. A controlled ultrasound wave is then applied to the material causing the total stress applied at a crack tip in the material to exceed the critical point. In some implementations, the controlled cracking is used for wafering of a material.","english":"Systems and methods are described for controlled crack propagation in a material using ultrasonic waves. A first stress in applied to the material such that the first stress is below a critical point of the material and is insufficient to initiate cracking of the material. A controlled ultrasound wave is then applied to the material causing the total stress applied at a crack tip in the material to exceed the critical point. In some implementations, the controlled cracking is used for wafering of a material."},"applicants":["ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY"],"inventors":["Mariana BERTONI","Pablo Guimera COLL"],"filingDate":"2022-11-21","publicationDate":"2026-08-04","grantDate":"2026-08-04","verifiedWithOffice":true,"pdfUrl":"https://downloadpatent.com/pdf/US12697753B2.pdf","pages":{"en":"https://downloadpatent.com/patent/US12697753B2","zh-Hant":"https://downloadpatent.com/zh-Hant/patent/US12697753B2","ja":"https://downloadpatent.com/ja/patent/US12697753B2"}}