{"number":"US12697808B2","kindCode":"B2","documentType":"grant","title":{"original":"Surface modification of solder paste stencils","english":"Surface modification of solder paste stencils"},"abstract":{"original":"The present disclosure relates to surface modification of solder paste stencils to provide improved adhesion of a functional coating. The disclosed surface modifications include laser structuring, plasma treatments, and primers. Methods of using the solder paste stencils are further disclosed.","english":"The present disclosure relates to surface modification of solder paste stencils to provide improved adhesion of a functional coating. The disclosed surface modifications include laser structuring, plasma treatments, and primers. Methods of using the solder paste stencils are further disclosed."},"applicants":["NEWTECH LLC"],"inventors":["Steven Martin Johnson","Fraser Murray Shaw"],"filingDate":"2022-08-25","publicationDate":"2026-08-04","grantDate":"2026-08-04","verifiedWithOffice":true,"pdfUrl":"https://downloadpatent.com/pdf/US12697808B2.pdf","pages":{"en":"https://downloadpatent.com/patent/US12697808B2","zh-Hant":"https://downloadpatent.com/zh-Hant/patent/US12697808B2","ja":"https://downloadpatent.com/ja/patent/US12697808B2"}}