{"number":"US12697814B2","kindCode":"B2","documentType":"grant","title":{"original":"Head module","english":"Head module"},"abstract":{"original":"A head module includes: a head chip having an actuator, a channel member having a channel deformable by the actuator, and a support made of metal and supporting the channel member, a heater assembly; and a heat conductor. The heat conductor has a first contacting part in thermal contact with the support, and a second contacting part in thermal contact with the heater assembly and the actuator.","english":"A head module includes: a head chip having an actuator, a channel member having a channel deformable by the actuator, and a support made of metal and supporting the channel member, a heater assembly; and a heat conductor. The heat conductor has a first contacting part in thermal contact with the support, and a second contacting part in thermal contact with the heater assembly and the actuator."},"applicants":["BROTHER KOGYO KABUSHIKI KAISHA"],"inventors":["Itsuki MORIMOTO","Yuki KAWAMURA"],"filingDate":"2024-03-20","publicationDate":"2026-08-04","grantDate":"2026-08-04","verifiedWithOffice":true,"pdfUrl":"https://downloadpatent.com/pdf/US12697814B2.pdf","pages":{"en":"https://downloadpatent.com/patent/US12697814B2","zh-Hant":"https://downloadpatent.com/zh-Hant/patent/US12697814B2","ja":"https://downloadpatent.com/ja/patent/US12697814B2"}}