{"number":"US12702192B2","kindCode":"B2","documentType":"grant","title":{"original":"Shoe with cut in the sole","english":"Shoe with cut in the sole"},"abstract":{"original":"A shoe includes a sole with a midsole, and an upper portion joined to the sole. The midsole includes a cut having a linear shape, and a depth from a first height position to a second height position in a thickness direction. The cut is configured such that a part of the cut has no contact point with an other part of the cut, and the cut forms a V shape at the deepest part on a cross section when opposite inner walls of the cut are spaced from each other.","english":"A shoe includes a sole with a midsole, and an upper portion joined to the sole. The midsole includes a cut having a linear shape, and a depth from a first height position to a second height position in a thickness direction. The cut is configured such that a part of the cut has no contact point with an other part of the cut, and the cut forms a V shape at the deepest part on a cross section when opposite inner walls of the cut are spaced from each other."},"applicants":["ASICS CORPORATION"],"inventors":["Kenta TATENO","Hiroaki NISHIMURA","Takayuki KOGURE","Yoshikazu MITSUHATA","Hiromichi OTAKE"],"filingDate":"2022-08-18","publicationDate":"2026-08-11","grantDate":"2026-08-11","verifiedWithOffice":true,"pdfUrl":"https://downloadpatent.com/pdf/US12702192B2.pdf","pages":{"en":"https://downloadpatent.com/patent/US12702192B2","zh-Hant":"https://downloadpatent.com/zh-Hant/patent/US12702192B2","ja":"https://downloadpatent.com/ja/patent/US12702192B2"}}