{"number":"US12703006B2","kindCode":"B2","documentType":"grant","title":{"original":"Method for manufacturing ultrasonic transducer, ultrasonic transducer, and distance measuring equipment","english":"Method for manufacturing ultrasonic transducer, ultrasonic transducer, and distance measuring equipment"},"abstract":{"original":"A method for manufacturing an ultrasonic transducer comprises the following steps: A first SOI substrate including a first silicon film, a second silicon film, and an intermediate silicon oxide film sandwiched between the first silicon film and the second silicon film is prepared. A piezoelectric element is formed on the first silicon film of the first SOI substrate. The second silicon film is etched to form a diaphragm. A silicon substrate is connected to the second silicon film.…","english":"A method for manufacturing an ultrasonic transducer comprises the following steps: A first SOI substrate including a first silicon film, a second silicon film, and an intermediate silicon oxide film sandwiched between the first silicon film and the second silicon film is prepared. A piezoelectric element is formed on the first silicon film of the first SOI substrate. The second silicon film is etched to form a diaphragm. A silicon substrate is connected to the second silicon film.…"},"applicants":["Mitsubishi Electric Corporation"],"inventors":["Yoshiaki HIRATA","Yoshitaka KAJIYAMA"],"filingDate":"2024-06-25","publicationDate":"2026-08-11","grantDate":"2026-08-11","verifiedWithOffice":true,"pdfUrl":"https://downloadpatent.com/pdf/US12703006B2.pdf","pages":{"en":"https://downloadpatent.com/patent/US12703006B2","zh-Hant":"https://downloadpatent.com/zh-Hant/patent/US12703006B2","ja":"https://downloadpatent.com/ja/patent/US12703006B2"}}