{"number":"US12703044B2","kindCode":"B2","documentType":"grant","title":{"original":"Soldering device including pulsed light irradiator, soldering method using pulsed light irradiation, and method of manufacturing semiconductor package","english":"Soldering device including pulsed light irradiator, soldering method using pulsed light irradiation, and method of manufacturing semiconductor package"},"abstract":{"original":"A soldering device includes a control unit to predict a final rise temperature of an electronic device, based on power of a light pulse from at least one pulsed light irradiator, a weight of the electronic device, a real-time temperature of the electronic device, the quantity of exposures of the light pulse, and an irradiation period of the light pulse, and change a condition of the light pulse, based on a predicted result.…","english":"A soldering device includes a control unit to predict a final rise temperature of an electronic device, based on power of a light pulse from at least one pulsed light irradiator, a weight of the electronic device, a real-time temperature of the electronic device, the quantity of exposures of the light pulse, and an irradiation period of the light pulse, and change a condition of the light pulse, based on a predicted result.…"},"applicants":["Samsung Electronics Co., Ltd."],"inventors":["Sinyeop LEE","Taegyu KANG","Jaeseon HWANG"],"filingDate":"2023-05-24","publicationDate":"2026-08-11","grantDate":"2026-08-11","verifiedWithOffice":true,"pdfUrl":"https://downloadpatent.com/pdf/US12703044B2.pdf","pages":{"en":"https://downloadpatent.com/patent/US12703044B2","zh-Hant":"https://downloadpatent.com/zh-Hant/patent/US12703044B2","ja":"https://downloadpatent.com/ja/patent/US12703044B2"}}