{"number":"US12703057B2","kindCode":"B2","documentType":"grant","title":{"original":"Method for detection of wafer slippage","english":"Method for detection of wafer slippage"},"abstract":{"original":"Exemplary methods for detecting substrate slippage include sweeping a first sensor and a second sensor of an in-situ monitoring system across the substrate as the substrate undergoes polishing with a rotatable platen. A first sequence of signal values from the first sensor and a second sequence of signal values from the second sensor include a signal strength relative to the thickness of the layer.…","english":"Exemplary methods for detecting substrate slippage include sweeping a first sensor and a second sensor of an in-situ monitoring system across the substrate as the substrate undergoes polishing with a rotatable platen. A first sequence of signal values from the first sensor and a second sequence of signal values from the second sensor include a signal strength relative to the thickness of the layer.…"},"applicants":["Applied Materials, Inc."],"inventors":["Wei Lu","Yu-Chi Yeh","Kun-Yo Lin","Wade Chung","Harry Q. Lee","Nick Huang","Jianshe Tang"],"filingDate":"2023-03-17","publicationDate":"2026-08-11","grantDate":"2026-08-11","verifiedWithOffice":true,"pdfUrl":"https://downloadpatent.com/pdf/US12703057B2.pdf","pages":{"en":"https://downloadpatent.com/patent/US12703057B2","zh-Hant":"https://downloadpatent.com/zh-Hant/patent/US12703057B2","ja":"https://downloadpatent.com/ja/patent/US12703057B2"}}