{"number":"US12703059B2","kindCode":"B2","documentType":"grant","title":{"original":"Polishing pad, double-side polishing device, and double-side polishing method for wafer","english":"Polishing pad, double-side polishing device, and double-side polishing method for wafer"},"abstract":{"original":"The present invention is a polishing pad having a polishing layer for polishing surface of a wafer and a double-sided tape for attaching the polishing layer to an upper turn table of a double-side polishing apparatus, wherein, the double-sided tape has a 90° peeling adhesive strength A of 2000 g/cm or more, and a ratio A/B of the 90° peeling adhesive strength A to a 180° peeling adhesive strength B of 1.05 or more, the double-sided tape has a base material, a polishing-layer-side adhesive layer to be attached to the polishing layer, and an upper-turn-table-side adhesive layer to be attached to…","english":"The present invention is a polishing pad having a polishing layer for polishing surface of a wafer and a double-sided tape for attaching the polishing layer to an upper turn table of a double-side polishing apparatus, wherein, the double-sided tape has a 90° peeling adhesive strength A of 2000 g/cm or more, and a ratio A/B of the 90° peeling adhesive strength A to a 180° peeling adhesive strength B of 1.05 or more, the double-sided tape has a base material, a polishing-layer-side adhesive layer to be attached to the polishing layer, and an upper-turn-table-side adhesive layer to be attached to…"},"applicants":["SHIN-ETSU HANDOTAI CO., LTD."],"inventors":["Junichi UENO"],"filingDate":"2023-05-04","publicationDate":"2026-08-11","grantDate":"2026-08-11","verifiedWithOffice":true,"pdfUrl":"https://downloadpatent.com/pdf/US12703059B2.pdf","pages":{"en":"https://downloadpatent.com/patent/US12703059B2","zh-Hant":"https://downloadpatent.com/zh-Hant/patent/US12703059B2","ja":"https://downloadpatent.com/ja/patent/US12703059B2"}}