{"number":"US12703061B2","kindCode":"B2","documentType":"grant","title":{"original":"Polishing apparatus","english":"Polishing apparatus"},"abstract":{"original":"The present invention relates to a polishing apparatus and a polishing method for polishing a workpiece, such as a wafer on which a pattern is formed, on a polishing pad, and more particularly, relates to a polishing apparatus and a polishing method for detecting a geometric element of a pattern, such as a pitch.…","english":"The present invention relates to a polishing apparatus and a polishing method for polishing a workpiece, such as a wafer on which a pattern is formed, on a polishing pad, and more particularly, relates to a polishing apparatus and a polishing method for detecting a geometric element of a pattern, such as a pitch.…"},"applicants":["Kyushu Institute of Technology","EBARA CORPORATION"],"inventors":["Hisanori MATSUO","Keisuke SUZUKI"],"filingDate":"2022-05-27","publicationDate":"2026-08-11","grantDate":"2026-08-11","verifiedWithOffice":true,"pdfUrl":"https://downloadpatent.com/pdf/US12703061B2.pdf","pages":{"en":"https://downloadpatent.com/patent/US12703061B2","zh-Hant":"https://downloadpatent.com/zh-Hant/patent/US12703061B2","ja":"https://downloadpatent.com/ja/patent/US12703061B2"}}