{"number":"US12703062B2","kindCode":"B2","documentType":"grant","title":{"original":"Wafer grinding parameter optimization method and electronic device","english":"Wafer grinding parameter optimization method and electronic device"},"abstract":{"original":"A wafer grinding parameter optimization method and an electronic device are provided. The method includes the following. A natural frequency of a grinding wheel spindle of wafer processing equipment is obtained, and a grinding stability lobe diagram is generated accordingly. A grinding speed is selected based on a speed range of the grinding wheel spindle. Multiple grinding parameter combinations are determined based on the grinding speed. Multiple grinding simulation result combinations corresponding to the grinding parameter combinations are generated.…","english":"A wafer grinding parameter optimization method and an electronic device are provided. The method includes the following. A natural frequency of a grinding wheel spindle of wafer processing equipment is obtained, and a grinding stability lobe diagram is generated accordingly. A grinding speed is selected based on a speed range of the grinding wheel spindle. Multiple grinding parameter combinations are determined based on the grinding speed. Multiple grinding simulation result combinations corresponding to the grinding parameter combinations are generated.…"},"applicants":["GlobalWafers Co., Ltd."],"inventors":["Chih-Chun Cheng","Wen-Nan Cheng","Meng-Bi Lin","Chi-Feng Li","Tzu-Fan Chiang","Wei-Jen Chen","Chien Hung Chen","Hsiu Chi Liang","Ying-Ru Shih"],"filingDate":"2023-09-12","publicationDate":"2026-08-11","grantDate":"2026-08-11","verifiedWithOffice":true,"pdfUrl":"https://downloadpatent.com/pdf/US12703062B2.pdf","pages":{"en":"https://downloadpatent.com/patent/US12703062B2","zh-Hant":"https://downloadpatent.com/zh-Hant/patent/US12703062B2","ja":"https://downloadpatent.com/ja/patent/US12703062B2"}}