US 12,697,664 B2

要約

An analysis device according to the present disclosure analyzes the state of a machining tool. The analysis device includes: an acquisition unit that acquires a measurement result from at least one sensor fitted to the machining tool; a computation unit that performs data processing to the measurement result acquired by the acquisition unit; and an image processing unit that displays a first image and a second image on a display screen, the first image displaying the measurement result acquired by the acquisition unit in time-series, the second image displaying a computation result after the d…

要約の冒頭のみ表示しています。全文は PDF にあります。