US 12,702,881 B1

要約

A sprinkler cover apparatus conceals sprinkler heads using temperature-responsive materials that release the cover when exposed to a set temperature, allowing unobstructed water flow. The apparatus is an imperceptible component of the ceiling or wall. Embodiments include single- and multi-piece designs, mounted to the ceiling or sprinkler head housing. Some embodiments do not contact the sprinkler head directly. Actuation is achieved via materials like shape-memory polymers (SMPs), shape-memory alloys (SMAs), liquid crystalline polymers, melting substances (e.g., wax, solder), or bimetals.…

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