美國
US 12,697,132 B2
Device and method for scar subcision
US 12,697,132 B2 是美國專利商標局（USPTO）的核准專利，日期 2026-08-04。申請人：Indiana University Research and Technology Corporation。PDF 可在本頁下載，未登入每天最多 5 篇。
- 申請人
- Indiana University Research and Technology Corporation
- 發明人
- Luke G. Gutwein; Rajiv Sood; Barry Davignon
- 公開日
- 2026-08-04
- 申請日
- 2021-01-11
- 文件種類
- B2 核准公告
- 也寫作
- US 12,697,132 B2 · US12697132 · 12697132
摘要
A scar subcision devices comprising a first elongated element comprising a pivotal connection to a second elongated element, the first elongated element having a blunt distal end, the second elongated element having a proximal-facing cutting edge at a distal end thereof, the device having a first state wherein the cutting edge is retracted to a location within an outer perimeter of the first elongated element, and a second state wherein the cutting edge is exposed outside of the outer perimeter of the first elongated element and the device transitioning between the first state and the second s…
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專利局網站： 美國專利商標局（USPTO）