美國
US 12,697,496 B2
Feedthrough assembly and implantable medical device including same
US 12,697,496 B2 是美國專利商標局（USPTO）的核准專利，日期 2026-08-04。申請人：Medtronic, Inc.。PDF 可在本頁下載，未登入每天最多 5 篇。
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- 申請人
- Medtronic, Inc.
- 發明人
- Andrew J. Ries; Mark E. Henschel; James R. Wasson; Chunho Kim; Walter E. Benecke; Kris A. Peterson; Jeff M. Wheeler; Songhua Shi
- 公開日
- 2026-08-04
- 申請日
- 2023-01-27
- 文件種類
- B2 核准公告
- 也寫作
- US 12,697,496 B2 · US12697496 · 12697496
摘要
Various embodiments of a feedthrough assembly are disclosed. The assembly includes a header and a test fanout layer electrically connected to the header. A first major surface of the test fanout layer faces an inner surface of the header. The assembly further includes a test via extending between the first major surface and a second major surface of the test fanout layer, and a test pad disposed on the first major surface of the test fanout layer and electrically connected to the test via.…
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專利局網站： 美國專利商標局（USPTO）