美國
US 12,697,671 B2
Solder reflow apparatus and method of manufacturing an electronic device
US 12,697,671 B2 是美國專利商標局（USPTO）的核准專利，日期 2026-08-04。申請人：SAMSUNG ELECTRONICS CO., LTD.。PDF 可在本頁下載，未登入每天最多 5 篇。
- 申請人
- SAMSUNG ELECTRONICS CO., LTD.
- 發明人
- Junga LEE; Youngja Kim; Hyunki Kim; Youngmin Lee
- 公開日
- 2026-08-04
- 申請日
- 2025-01-17
- 文件種類
- B2 核准公告
- 也寫作
- US 12,697,671 B2 · US12697671 · 12697671
摘要
An apparatus includes: a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated by the heat transfer fluid; a heater configured to heat the heat transfer fluid in the vapor generating chamber; a substrate stage configured to be movable upward or downward in the vapor generating chamber and to support a substrate on which an electronic device is mounted via a solder. The apparatus also includes at least one mesh plate extending in a horizontal direction in the vapor generating chamber.…
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專利局網站： 美國專利商標局（USPTO）