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美國

US 12,697,686 B2

Laser machining system

US 12,697,686 B2 是美國專利商標局(USPTO)的核准專利,日期 2026-08-04。申請人:Mitsubishi Electric Corporation。PDF 可在本頁下載,未登入每天最多 5 篇。

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申請人
Mitsubishi Electric Corporation
發明人
Kenta FUJII; Motoaki NISHIWAKI; Kyohei ISHIKAWA
公開日
2026-08-04
申請日
2022-08-09
文件種類
B2 核准公告
也寫作
US 12,697,686 B2 · US12697686 · 12697686

摘要

A control device that executes machining to cut a workpiece into a part and a remaining material; a detection unit that determines, as a time-series signal, a result of observing in time series a state of the workpiece; a machining state evaluation unit that determines, as evaluation information, a result of evaluation on a state of the machining for each of sections obtained by dividing the machining path, based on the time-series signal; an evaluation information storage unit that stores contour line evaluation information in which a contour line is associated with the evaluation information…

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專利局網站: 美國專利商標局(USPTO)

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