美國
US 12,697,686 B2
Laser machining system
US 12,697,686 B2 是美國專利商標局(USPTO)的核准專利,日期 2026-08-04。申請人:Mitsubishi Electric Corporation。PDF 可在本頁下載,未登入每天最多 5 篇。
- 申請人
- Mitsubishi Electric Corporation
- 發明人
- Kenta FUJII; Motoaki NISHIWAKI; Kyohei ISHIKAWA
- 公開日
- 2026-08-04
- 申請日
- 2022-08-09
- 文件種類
- B2 核准公告
- 也寫作
- US 12,697,686 B2 · US12697686 · 12697686
摘要
A control device that executes machining to cut a workpiece into a part and a remaining material; a detection unit that determines, as a time-series signal, a result of observing in time series a state of the workpiece; a machining state evaluation unit that determines, as evaluation information, a result of evaluation on a state of the machining for each of sections obtained by dividing the machining path, based on the time-series signal; an evaluation information storage unit that stores contour line evaluation information in which a contour line is associated with the evaluation information…
這裡只列摘要開頭,完整內容在 PDF 裡。
不用登入,每天可下載 5 篇(今天還剩 5 篇)。批次下載與 OA 引證整理需免費註冊。
專利局網站: 美國專利商標局(USPTO)