美國
US 12,697,698 B2
Recycled polishing pad and preparation method thereof
US 12,697,698 B2 是美國專利商標局（USPTO）的核准專利，日期 2026-08-04。申請人：Enpulse Co., Ltd.。PDF 可在本頁下載，未登入每天最多 5 篇。
- 申請人
- Enpulse Co., Ltd.
- 發明人
- Jungnam LEE; Seungsik YOON; Jaechul CHANG; Jaejung BYUN; Yongsoo CHOI; Yujin SHIN; Jongwoo KIM; Sunghyung OH
- 公開日
- 2026-08-04
- 申請日
- 2025-07-21
- 文件種類
- B2 核准公告
- 也寫作
- US 12,697,698 B2 · US12697698 · 12697698
摘要
According to embodiments of the present invention, there are provided a recycled polishing pad and a process for preparing a recycled polishing pad. The recycled polishing pad comprises a cushion layer, an adhesive layer, and a reused polishing layer having a plurality of grooves on one side, and the compressibility of the reused polishing layer calculated by a specific equation is controlled within a predetermined range; thus, the polishing layer can be reused while excellent polishing rate and polishing uniformity are maintained.
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專利局網站： 美國專利商標局（USPTO）