美國
US 12,697,699 B2
Retainer, top ring, and substrate processing apparatus
US 12,697,699 B2 是美國專利商標局（USPTO）的核准專利，日期 2026-08-04。申請人：EBARA CORPORATION。PDF 可在本頁下載，未登入每天最多 5 篇。
- 申請人
- EBARA CORPORATION
- 發明人
- Yu ISHII
- 公開日
- 2026-08-04
- 申請日
- 2023-06-16
- 文件種類
- B2 核准公告
- 也寫作
- US 12,697,699 B2 · US12697699 · 12697699
摘要
A retainer is disposed around a holding region 39 of a polygonal substrate WF in a top ring for holding the polygonal substrate WF with a surface to be polished facing downward. The retainer 30 includes a plurality of retainer main bodies 3 disposed around the holding region 39 independently along respective sides of the polygonal substrate WF. At least one of the plurality of retainer main bodies 3 includes a first securing surface (first surface 3a), a first opposed surface (second surface 3b), a second securing surface (third surface 3c), and a second opposed surface (fourth surface 3d).…
這裡只列摘要開頭，完整內容在 PDF 裡。
不用登入，每天可下載 5 篇（今天還剩 5 篇）。批次下載與 OA 引證整理需免費註冊。
專利局網站： 美國專利商標局（USPTO）