美國
US 12,697,719 B2
Process kit alignment method for improving semiconductor yield
US 12,697,719 B2 是美國專利商標局（USPTO）的核准專利，日期 2026-08-04。申請人：Applied Materials, Inc.。PDF 可在本頁下載，未登入每天最多 5 篇。
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- 申請人
- Applied Materials, Inc.
- 發明人
- Damon K. Cox; Ali Utku Pehlivan; Paul Benjamin Reuter
- 公開日
- 2026-08-04
- 申請日
- 2023-09-11
- 文件種類
- B2 核准公告
- 也寫作
- US 12,697,719 B2 · US12697719 · 12697719
摘要
A method includes causing an upper process kit ring to be removed from a lower process kit ring. The method further includes, responsive to causing the upper process kit ring to be removed from the lower process kit ring, causing, based on sensor data, a first position correction associated with the lower process kit ring. The method further includes, responsive to the first position correction, causing the upper process kit ring to be disposed on the lower process kit ring.
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專利局網站： 美國專利商標局（USPTO）