美國
US 12,697,753 B2
Sound-assisted crack propagation for semiconductor wafering
US 12,697,753 B2 是美國專利商標局（USPTO）的核准專利，日期 2026-08-04。申請人：ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY。PDF 可在本頁下載，未登入每天最多 5 篇。
- 申請人
- ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY
- 發明人
- Mariana BERTONI; Pablo Guimera COLL
- 公開日
- 2026-08-04
- 申請日
- 2022-11-21
- 文件種類
- B2 核准公告
- 也寫作
- US 12,697,753 B2 · US12697753 · 12697753
摘要
Systems and methods are described for controlled crack propagation in a material using ultrasonic waves. A first stress in applied to the material such that the first stress is below a critical point of the material and is insufficient to initiate cracking of the material. A controlled ultrasound wave is then applied to the material causing the total stress applied at a crack tip in the material to exceed the critical point. In some implementations, the controlled cracking is used for wafering of a material.
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專利局網站： 美國專利商標局（USPTO）