美國
US 12,697,763 B2
Three-dimensional network structure and manufacturing method therefor
US 12,697,763 B2 是美國專利商標局（USPTO）的核准專利，日期 2026-08-04。申請人：TOYOBO MC Corporation。PDF 可在本頁下載，未登入每天最多 5 篇。
- 申請人
- TOYOBO MC Corporation
- 發明人
- Fumika Kawano; Teruyuki Taninaka; Daisuke Sakura; Shinichi Kobuchi
- 公開日
- 2026-08-04
- 申請日
- 2024-09-11
- 文件種類
- B2 核准公告
- 也寫作
- US 12,697,763 B2 · US12697763 · 12697763
摘要
It is provided that: a three-dimensional network structure that exhibits excellent cushioning property and excellent compression recoverability after thermal compression at a usage environmental temperature; and a manufacturing method therefor. A three-dimensional network structure having a three-dimensional random loop-bonded configuration and comprising a continuous filament made from a thermoplastic resin composition, wherein the thermoplastic resin composition contains 70% by mass or higher of a polybutylene adipate terephthalate resin, and an enthalpy of an endothermic peak in which a DSC…
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專利局網站： 美國專利商標局（USPTO）