美國
US 12,697,791 B2
Moulding apparatus
US 12,697,791 B2 是美國專利商標局（USPTO）的核准專利，日期 2026-08-04。申請人：CENTRE TECHNIQUE INDUSTRIEL DE LA PLASTURGIE ET DES COMPOSITES。PDF 可在本頁下載，未登入每天最多 5 篇。
- 申請人
- CENTRE TECHNIQUE INDUSTRIEL DE LA PLASTURGIE ET DES COMPOSITES
- 發明人
- Damien GIRAUD
- 公開日
- 2026-08-04
- 申請日
- 2024-01-31
- 文件種類
- B2 核准公告
- 也寫作
- US 12,697,791 B2 · US12697791 · 12697791
摘要
The present disclosure concerns a molding apparatus including: a first thermally conductive flange and a second thermally conductive flange, said first and second thermally conductive flanges delimiting a cavity configured to receive thermoplastic pre-impregnated textiles, a mold thermally conductive and thermoregulated by a heat transfer fluid—comprising an upper impression and a lower impression, said upper and lower impressions being configured to receive said first and second thermally conductive flanges.
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專利局網站： 美國專利商標局（USPTO）