美國
US 12,703,044 B2
Soldering device including pulsed light irradiator, soldering method using pulsed light irradiation, and method of manufacturing semiconductor package
US 12,703,044 B2 是美國專利商標局（USPTO）的核准專利，日期 2026-08-11。申請人：Samsung Electronics Co., Ltd.。PDF 可在本頁下載，未登入每天最多 5 篇。
- 申請人
- Samsung Electronics Co., Ltd.
- 發明人
- Sinyeop LEE; Taegyu KANG; Jaeseon HWANG
- 公開日
- 2026-08-11
- 申請日
- 2023-05-24
- 文件種類
- B2 核准公告
- 也寫作
- US 12,703,044 B2 · US12703044 · 12703044
摘要
A soldering device includes a control unit to predict a final rise temperature of an electronic device, based on power of a light pulse from at least one pulsed light irradiator, a weight of the electronic device, a real-time temperature of the electronic device, the quantity of exposures of the light pulse, and an irradiation period of the light pulse, and change a condition of the light pulse, based on a predicted result.…
這裡只列摘要開頭，完整內容在 PDF 裡。
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專利局網站： 美國專利商標局（USPTO）