美國
US 12,703,058 B2
Surface property measuring system, surface property measuring method, polishing apparatus, and polishing method
US 12,703,058 B2 是美國專利商標局（USPTO）的核准專利，日期 2026-08-11。申請人：EBARA CORPORATION。PDF 可在本頁下載，未登入每天最多 5 篇。
- 申請人
- EBARA CORPORATION
- 發明人
- Toshifumi KIMBA; Kohei OHSHIMA; Kohei OTA
- 公開日
- 2026-08-11
- 申請日
- 2023-04-20
- 文件種類
- B2 核准公告
- 也寫作
- US 12,703,058 B2 · US12703058 · 12703058
摘要
A surface property measuring system capable of accurately measuring a surface property of a polishing pad without damaging the polishing pad and without reducing throughput of the entire polishing process is disclosed. The surface property measuring system includes: an optical measuring device configured to direct light to a polishing surface of a polishing pad when the polishing pad is rotating, and measure a surface property of the polishing pad based on reflected light from the polishing surface; a cover member disposed between the optical measuring device and the polishing pad; and a trans…
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專利局網站： 美國專利商標局（USPTO）