美國
US 12,703,059 B2
Polishing pad, double-side polishing device, and double-side polishing method for wafer
US 12,703,059 B2 是美國專利商標局（USPTO）的核准專利，日期 2026-08-11。申請人：SHIN-ETSU HANDOTAI CO., LTD.。PDF 可在本頁下載，未登入每天最多 5 篇。
- 申請人
- SHIN-ETSU HANDOTAI CO., LTD.
- 發明人
- Junichi UENO
- 公開日
- 2026-08-11
- 申請日
- 2023-05-04
- 文件種類
- B2 核准公告
- 也寫作
- US 12,703,059 B2 · US12703059 · 12703059
摘要
The present invention is a polishing pad having a polishing layer for polishing surface of a wafer and a double-sided tape for attaching the polishing layer to an upper turn table of a double-side polishing apparatus, wherein, the double-sided tape has a 90° peeling adhesive strength A of 2000 g/cm or more, and a ratio A/B of the 90° peeling adhesive strength A to a 180° peeling adhesive strength B of 1.05 or more, the double-sided tape has a base material, a polishing-layer-side adhesive layer to be attached to the polishing layer, and an upper-turn-table-side adhesive layer to be attached to…
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專利局網站： 美國專利商標局（USPTO）