美國
US 12,703,062 B2
Wafer grinding parameter optimization method and electronic device
US 12,703,062 B2 是美國專利商標局（USPTO）的核准專利，日期 2026-08-11。申請人：GlobalWafers Co., Ltd.。PDF 可在本頁下載，未登入每天最多 5 篇。
- 申請人
- GlobalWafers Co., Ltd.
- 發明人
- Chih-Chun Cheng; Wen-Nan Cheng; Meng-Bi Lin; Chi-Feng Li; Tzu-Fan Chiang; Wei-Jen Chen; Chien Hung Chen; Hsiu Chi Liang; Ying-Ru Shih
- 公開日
- 2026-08-11
- 申請日
- 2023-09-12
- 文件種類
- B2 核准公告
- 也寫作
- US 12,703,062 B2 · US12703062 · 12703062
摘要
A wafer grinding parameter optimization method and an electronic device are provided. The method includes the following. A natural frequency of a grinding wheel spindle of wafer processing equipment is obtained, and a grinding stability lobe diagram is generated accordingly. A grinding speed is selected based on a speed range of the grinding wheel spindle. Multiple grinding parameter combinations are determined based on the grinding speed. Multiple grinding simulation result combinations corresponding to the grinding parameter combinations are generated.…
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專利局網站： 美國專利商標局（USPTO）