美國
US 12,703,063 B2
Substrate processing apparatus
US 12,703,063 B2 是美國專利商標局（USPTO）的核准專利，日期 2026-08-11。申請人：EBARA CORPORATION。PDF 可在本頁下載，未登入每天最多 5 篇。
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- 申請人
- EBARA CORPORATION
- 發明人
- MATSUTARO MIYAMOTO
- 公開日
- 2026-08-11
- 申請日
- 2023-09-06
- 文件種類
- B2 核准公告
- 也寫作
- US 12,703,063 B2 · US12703063 · 12703063
摘要
The substrate processing apparatus according to the disclosure is a substrate processing apparatus for processing a substrate. The substrate processing apparatus includes a swing module, which includes a base portion, an arm which is supported by the base portion and is rotatable about the base portion, and a cover which covers an upper surface of the arm. The cover has an elongated shape in plan view and has a protrusion formed on an outer peripheral portion of an upper surface of the cover to protrude upward.…
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專利局網站： 美國專利商標局（USPTO）