United States
US 12,697,132 B2
Device and method for scar subcision
US 12,697,132 B2 is a granted patent from the United States Patent and Trademark Office (USPTO), dated 2026-08-04. Applicant: Indiana University Research and Technology Corporation. Its PDF downloads from this page without an account, up to 5 a day.
- Applicant
- Indiana University Research and Technology Corporation
- Inventors
- Luke G. Gutwein; Rajiv Sood; Barry Davignon
- Publication date
- 2026-08-04
- Filing date
- 2021-01-11
- Document type
- B2 Granted patent
- Also written as
- US 12,697,132 B2 · US12697132 · 12697132
Abstract
A scar subcision devices comprising a first elongated element comprising a pivotal connection to a second elongated element, the first elongated element having a blunt distal end, the second elongated element having a proximal-facing cutting edge at a distal end thereof, the device having a first state wherein the cutting edge is retracted to a location within an outer perimeter of the first elongated element, and a second state wherein the cutting edge is exposed outside of the outer perimeter of the first elongated element and the device transitioning between the first state and the second s…
The opening of the abstract. The full text is in the PDF.
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Patent office website: United States Patent and Trademark Office (USPTO)
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