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United States

US 12,697,133 B2

System for incising leaflets of a heart valve

US 12,697,133 B2 is a granted patent from the United States Patent and Trademark Office (USPTO), dated 2026-08-04. Applicant: Bedrosian Global, LLC. Its PDF downloads from this page without an account, up to 5 a day.

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Applicant
Bedrosian Global, LLC
Inventors
David Rizik; Bert Bedrosian
Publication date
2026-08-04
Filing date
2022-11-17
Document type
B2 Granted patent
Also written as
US 12,697,133 B2 · US12697133 · 12697133

Abstract

A cutting system for use prior to valve replacement that includes a cutting assembly and a sheath. The cutting assembly includes an expansion member that is movable between a stowed position and an expanded position, and at least a first cutting member associated with the expansion member. The first cutting member is configured to incise a first leaflet. The sheath defines a lumen therethrough and the cutting assembly is movable within the lumen.

The opening of the abstract. The full text is in the PDF.

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Patent office website: United States Patent and Trademark Office (USPTO)

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