United States
US 12,697,475 B2
Microneedle patch base layer lamination and separation device, microneedle patch base layer lamination device, and microneedle patch demolding and separation device
US 12,697,475 B2 is a granted patent from the United States Patent and Trademark Office (USPTO), dated 2026-08-04. Applicant: ZHUHAI CREWAY PHARMACEUTICAL TECHNOLOGY CO., LTD; YOUWE (ZHUHAI) BIOTECHNOLOGY CO., LTD. Its PDF downloads from this page without an account, up to 5 a day.
- Applicant
- ZHUHAI CREWAY PHARMACEUTICAL TECHNOLOGY CO., LTD; YOUWE (ZHUHAI) BIOTECHNOLOGY CO., LTD
- Inventors
- Chengguo LI; Gang LENG; Yonghao MA; Hong WANG; Lianhua CHEN
- Publication date
- 2026-08-04
- Filing date
- 2024-11-18
- Document type
- B2 Granted patent
- Also written as
- US 12,697,475 B2 · US12697475 · 12697475
Abstract
A microneedle patch base layer lamination and separation device and a control method therefor, a microneedle patch base layer lamination device and a control method therefor, and a microneedle patch demolding and separation device and a control method therefor are provided. The microneedle patch base layer lamination and separation device includes a rack, a movement control mechanism, a movable seat, and a lamination and separation apparatus.…
The opening of the abstract. The full text is in the PDF.
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Patent office website: United States Patent and Trademark Office (USPTO)
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