United States
US 12,697,496 B2
Feedthrough assembly and implantable medical device including same
US 12,697,496 B2 is a granted patent from the United States Patent and Trademark Office (USPTO), dated 2026-08-04. Applicant: Medtronic, Inc. Its PDF downloads from this page without an account, up to 5 a day.
- Applicant
- Medtronic, Inc.
- Inventors
- Andrew J. Ries; Mark E. Henschel; James R. Wasson; Chunho Kim; Walter E. Benecke; Kris A. Peterson; Jeff M. Wheeler; Songhua Shi
- Publication date
- 2026-08-04
- Filing date
- 2023-01-27
- Document type
- B2 Granted patent
- Also written as
- US 12,697,496 B2 · US12697496 · 12697496
Abstract
Various embodiments of a feedthrough assembly are disclosed. The assembly includes a header and a test fanout layer electrically connected to the header. A first major surface of the test fanout layer faces an inner surface of the header. The assembly further includes a test via extending between the first major surface and a second major surface of the test fanout layer, and a test pad disposed on the first major surface of the test fanout layer and electrically connected to the test via.…
The opening of the abstract. The full text is in the PDF.
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Patent office website: United States Patent and Trademark Office (USPTO)
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