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United States

US 12,697,600 B2

Polymeric material composition

US 12,697,600 B2 is a granted patent from the United States Patent and Trademark Office (USPTO), dated 2026-08-04. Applicant: UPL LIMITED. Its PDF downloads from this page without an account, up to 5 a day.

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Applicant
UPL LIMITED
Inventors
Rajan Ramakant SHIRSAT; Pradip Dattatray WAGH
Publication date
2026-08-04
Filing date
2023-11-09
Document type
B2 Granted patent
Also written as
US 12,697,600 B2 · US12697600 · 12697600

Abstract

The present invention provides a polymeric material composition comprising: (a) at least one superabsorbent polymer; and (b) 0.1% w/w to 2% w/w microporous silicon dioxide; wherein polymeric material composition exhibits non-hygroscopic characteristics with moisture content less than 15% w/w of the total weight of the polymeric material composition at room temperature. The present invention further provides process of preparing said polymeric composition and method of its application.

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Patent office website: United States Patent and Trademark Office (USPTO)

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