United States
US 12,697,639 B2
Glue supply apparatus for gypsum board, gypsum board manufacturing apparatus, and gypsum board manufacturing method
US 12,697,639 B2 is a granted patent from the United States Patent and Trademark Office (USPTO), dated 2026-08-04. Applicant: YOSHINO GYPSUM CO., LTD. Its PDF downloads from this page without an account, up to 5 a day.
- Applicant
- YOSHINO GYPSUM CO., LTD.
- Inventors
- Yuichi HIROOKA
- Publication date
- 2026-08-04
- Filing date
- 2023-07-05
- Document type
- B2 Granted patent
- Also written as
- US 12,697,639 B2 · US12697639 · 12697639
Abstract
A glue supply apparatus for a gypsum board supplies glue to a board base paper of the gypsum board. The glue supply apparatus includes a tank section configured to store the glue; a supply port disposed near an end of the board base paper of the gypsum board and configured to supply the glue; and a pump section disposed on a glue supply path between the tank section and the supply port. The pump section is a positive displacement pump.
The opening of the abstract. The full text is in the PDF.
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Patent office website: United States Patent and Trademark Office (USPTO)
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