United States
US 12,697,664 B2
Analysis device, analysis method, machining system, and program
US 12,697,664 B2 is a granted patent from the United States Patent and Trademark Office (USPTO), dated 2026-08-04. Applicant: Sumitomo Electric Industries, Ltd. Its PDF downloads from this page without an account, up to 5 a day.
- Applicant
- Sumitomo Electric Industries, Ltd.
- Inventors
- Akihiro TOYOSHIMA
- Publication date
- 2026-08-04
- Filing date
- 2024-04-16
- Document type
- B2 Granted patent
- Also written as
- US 12,697,664 B2 · US12697664 · 12697664
Abstract
An analysis device according to the present disclosure analyzes the state of a machining tool. The analysis device includes: an acquisition unit that acquires a measurement result from at least one sensor fitted to the machining tool; a computation unit that performs data processing to the measurement result acquired by the acquisition unit; and an image processing unit that displays a first image and a second image on a display screen, the first image displaying the measurement result acquired by the acquisition unit in time-series, the second image displaying a computation result after the d…
The opening of the abstract. The full text is in the PDF.
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Patent office website: United States Patent and Trademark Office (USPTO)
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