United States
US 12,697,671 B2
Solder reflow apparatus and method of manufacturing an electronic device
US 12,697,671 B2 is a granted patent from the United States Patent and Trademark Office (USPTO), dated 2026-08-04. Applicant: SAMSUNG ELECTRONICS CO., LTD. Its PDF downloads from this page without an account, up to 5 a day.
- Applicant
- SAMSUNG ELECTRONICS CO., LTD.
- Inventors
- Junga LEE; Youngja Kim; Hyunki Kim; Youngmin Lee
- Publication date
- 2026-08-04
- Filing date
- 2025-01-17
- Document type
- B2 Granted patent
- Also written as
- US 12,697,671 B2 · US12697671 · 12697671
Abstract
An apparatus includes: a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated by the heat transfer fluid; a heater configured to heat the heat transfer fluid in the vapor generating chamber; a substrate stage configured to be movable upward or downward in the vapor generating chamber and to support a substrate on which an electronic device is mounted via a solder. The apparatus also includes at least one mesh plate extending in a horizontal direction in the vapor generating chamber.…
The opening of the abstract. The full text is in the PDF.
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Patent office website: United States Patent and Trademark Office (USPTO)
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