United States
US 12,697,682 B2
Polycrystalline diamond (PCD) laser lapping machine
US 12,697,682 B2 is a granted patent from the United States Patent and Trademark Office (USPTO), dated 2026-08-04. Applicant: II-VI Delaware, Inc. Its PDF downloads from this page without an account, up to 5 a day.
- Applicant
- II-VI Delaware, Inc.
- Inventors
- Xiquan Wu
- Publication date
- 2026-08-04
- Filing date
- 2023-01-24
- Document type
- B2 Granted patent
- Also written as
- US 12,697,682 B2 · US12697682 · 12697682
Abstract
A laser lapping machine has a platform for supporting and rotating a product, and a laser device for transmitting a laser beam onto the surface of the product. The product may contain polycrystalline diamond, and the platform and the laser device may be configured to move a cutting point along a spiral path across the product surface. A process for removing material, such as polycrystalline diamond material, from a surface of a product is also described.…
The opening of the abstract. The full text is in the PDF.
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Patent office website: United States Patent and Trademark Office (USPTO)
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