United States
US 12,697,686 B2
Laser machining system
US 12,697,686 B2 is a granted patent from the United States Patent and Trademark Office (USPTO), dated 2026-08-04. Applicant: Mitsubishi Electric Corporation. Its PDF downloads from this page without an account, up to 5 a day.
- Applicant
- Mitsubishi Electric Corporation
- Inventors
- Kenta FUJII; Motoaki NISHIWAKI; Kyohei ISHIKAWA
- Publication date
- 2026-08-04
- Filing date
- 2022-08-09
- Document type
- B2 Granted patent
- Also written as
- US 12,697,686 B2 · US12697686 · 12697686
Abstract
A control device that executes machining to cut a workpiece into a part and a remaining material; a detection unit that determines, as a time-series signal, a result of observing in time series a state of the workpiece; a machining state evaluation unit that determines, as evaluation information, a result of evaluation on a state of the machining for each of sections obtained by dividing the machining path, based on the time-series signal; an evaluation information storage unit that stores contour line evaluation information in which a contour line is associated with the evaluation information…
The opening of the abstract. The full text is in the PDF.
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Patent office website: United States Patent and Trademark Office (USPTO)
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