United States
US 12,697,688 B2
Semiconductor device manufacturing apparatus and manufacturing method
US 12,697,688 B2 is a granted patent from the United States Patent and Trademark Office (USPTO), dated 2026-08-04. Applicant: Yamaha Robotics Co., Ltd. Its PDF downloads from this page without an account, up to 5 a day.
- Applicant
- Yamaha Robotics Co., Ltd.
- Inventors
- Kohei SEYAMA; Makoto TAKAHASHI
- Publication date
- 2026-08-04
- Filing date
- 2023-03-01
- Document type
- B2 Granted patent
- Also written as
- US 12,697,688 B2 · US12697688 · 12697688
Abstract
A semiconductor device manufacturing device comprises: a stage; two bonding heads which are mutually independently horizontally movable; and a controller for causing each of the two bonding heads to perform a positioning process for horizontal positioning, a grounding process for lowering the chip until the chip is grounded on a substrate, and a pressurizing process for applying a bonding load to the chip that is grounded.…
The opening of the abstract. The full text is in the PDF.
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Patent office website: United States Patent and Trademark Office (USPTO)
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