United States
US 12,697,698 B2
Recycled polishing pad and preparation method thereof
US 12,697,698 B2 is a granted patent from the United States Patent and Trademark Office (USPTO), dated 2026-08-04. Applicant: Enpulse Co., Ltd. Its PDF downloads from this page without an account, up to 5 a day.
- Applicant
- Enpulse Co., Ltd.
- Inventors
- Jungnam LEE; Seungsik YOON; Jaechul CHANG; Jaejung BYUN; Yongsoo CHOI; Yujin SHIN; Jongwoo KIM; Sunghyung OH
- Publication date
- 2026-08-04
- Filing date
- 2025-07-21
- Document type
- B2 Granted patent
- Also written as
- US 12,697,698 B2 · US12697698 · 12697698
Abstract
According to embodiments of the present invention, there are provided a recycled polishing pad and a process for preparing a recycled polishing pad. The recycled polishing pad comprises a cushion layer, an adhesive layer, and a reused polishing layer having a plurality of grooves on one side, and the compressibility of the reused polishing layer calculated by a specific equation is controlled within a predetermined range; thus, the polishing layer can be reused while excellent polishing rate and polishing uniformity are maintained.
The opening of the abstract. The full text is in the PDF.
No account needed: 5 free downloads a day (5 left today). Batch downloads and Office Action citations need a free account.
Patent office website: United States Patent and Trademark Office (USPTO)
Look up another patent
Need many patents at once?
Paste a whole list of numbers. DownloadPatent finds the right version of each and packs the PDFs into one ZIP.
Sign up free