United States
US 12,697,699 B2
Retainer, top ring, and substrate processing apparatus
US 12,697,699 B2 is a granted patent from the United States Patent and Trademark Office (USPTO), dated 2026-08-04. Applicant: EBARA CORPORATION. Its PDF downloads from this page without an account, up to 5 a day.
- Applicant
- EBARA CORPORATION
- Inventors
- Yu ISHII
- Publication date
- 2026-08-04
- Filing date
- 2023-06-16
- Document type
- B2 Granted patent
- Also written as
- US 12,697,699 B2 · US12697699 · 12697699
Abstract
A retainer is disposed around a holding region 39 of a polygonal substrate WF in a top ring for holding the polygonal substrate WF with a surface to be polished facing downward. The retainer 30 includes a plurality of retainer main bodies 3 disposed around the holding region 39 independently along respective sides of the polygonal substrate WF. At least one of the plurality of retainer main bodies 3 includes a first securing surface (first surface 3a), a first opposed surface (second surface 3b), a second securing surface (third surface 3c), and a second opposed surface (fourth surface 3d).…
The opening of the abstract. The full text is in the PDF.
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Patent office website: United States Patent and Trademark Office (USPTO)
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