United States
US 12,697,709 B1
Tool kit structure
US 12,697,709 B1 is a granted patent from the United States Patent and Trademark Office (USPTO), dated 2026-08-04. Applicant: Individual. Its PDF downloads from this page without an account, up to 5 a day.
- Applicant
- Individual
- Inventors
- Yen-Ming Su
- Publication date
- 2026-08-04
- Filing date
- 2025-03-14
- Document type
- B1 Granted patent
- Also written as
- US 12,697,709 B1 · US12697709 · 12697709
Abstract
A tool kit structure includes a first body, a second body, a third body, and a fourth body. The first body is provided with a first receiving recess, a second receiving recess, two second pivot portions, multiple third receiving recesses, a fourth receiving recess, at least one first hollow slot, a fifth receiving recess, and a second hollow slot. The second body is mounted in the first receiving recess. The third body is assembled in the second receiving recess. The third body is provided with multiple mounting portions.…
The opening of the abstract. The full text is in the PDF.
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Patent office website: United States Patent and Trademark Office (USPTO)
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