United States
US 12,697,719 B2
Process kit alignment method for improving semiconductor yield
US 12,697,719 B2 is a granted patent from the United States Patent and Trademark Office (USPTO), dated 2026-08-04. Applicant: Applied Materials, Inc. Its PDF downloads from this page without an account, up to 5 a day.
- Applicant
- Applied Materials, Inc.
- Inventors
- Damon K. Cox; Ali Utku Pehlivan; Paul Benjamin Reuter
- Publication date
- 2026-08-04
- Filing date
- 2023-09-11
- Document type
- B2 Granted patent
- Also written as
- US 12,697,719 B2 · US12697719 · 12697719
Abstract
A method includes causing an upper process kit ring to be removed from a lower process kit ring. The method further includes, responsive to causing the upper process kit ring to be removed from the lower process kit ring, causing, based on sensor data, a first position correction associated with the lower process kit ring. The method further includes, responsive to the first position correction, causing the upper process kit ring to be disposed on the lower process kit ring.
The opening of the abstract. The full text is in the PDF.
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Patent office website: United States Patent and Trademark Office (USPTO)
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