United States
US 12,697,753 B2
Sound-assisted crack propagation for semiconductor wafering
US 12,697,753 B2 is a granted patent from the United States Patent and Trademark Office (USPTO), dated 2026-08-04. Applicant: ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY. Its PDF downloads from this page without an account, up to 5 a day.
- Applicant
- ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY
- Inventors
- Mariana BERTONI; Pablo Guimera COLL
- Publication date
- 2026-08-04
- Filing date
- 2022-11-21
- Document type
- B2 Granted patent
- Also written as
- US 12,697,753 B2 · US12697753 · 12697753
Abstract
Systems and methods are described for controlled crack propagation in a material using ultrasonic waves. A first stress in applied to the material such that the first stress is below a critical point of the material and is insufficient to initiate cracking of the material. A controlled ultrasound wave is then applied to the material causing the total stress applied at a crack tip in the material to exceed the critical point. In some implementations, the controlled cracking is used for wafering of a material.
The opening of the abstract. The full text is in the PDF.
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Patent office website: United States Patent and Trademark Office (USPTO)
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