United States
US 12,697,763 B2
Three-dimensional network structure and manufacturing method therefor
US 12,697,763 B2 is a granted patent from the United States Patent and Trademark Office (USPTO), dated 2026-08-04. Applicant: TOYOBO MC Corporation. Its PDF downloads from this page without an account, up to 5 a day.
- Applicant
- TOYOBO MC Corporation
- Inventors
- Fumika Kawano; Teruyuki Taninaka; Daisuke Sakura; Shinichi Kobuchi
- Publication date
- 2026-08-04
- Filing date
- 2024-09-11
- Document type
- B2 Granted patent
- Also written as
- US 12,697,763 B2 · US12697763 · 12697763
Abstract
It is provided that: a three-dimensional network structure that exhibits excellent cushioning property and excellent compression recoverability after thermal compression at a usage environmental temperature; and a manufacturing method therefor. A three-dimensional network structure having a three-dimensional random loop-bonded configuration and comprising a continuous filament made from a thermoplastic resin composition, wherein the thermoplastic resin composition contains 70% by mass or higher of a polybutylene adipate terephthalate resin, and an enthalpy of an endothermic peak in which a DSC…
The opening of the abstract. The full text is in the PDF.
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Patent office website: United States Patent and Trademark Office (USPTO)
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