United States
US 12,697,791 B2
Moulding apparatus
US 12,697,791 B2 is a granted patent from the United States Patent and Trademark Office (USPTO), dated 2026-08-04. Applicant: CENTRE TECHNIQUE INDUSTRIEL DE LA PLASTURGIE ET DES COMPOSITES. Its PDF downloads from this page without an account, up to 5 a day.
- Applicant
- CENTRE TECHNIQUE INDUSTRIEL DE LA PLASTURGIE ET DES COMPOSITES
- Inventors
- Damien GIRAUD
- Publication date
- 2026-08-04
- Filing date
- 2024-01-31
- Document type
- B2 Granted patent
- Also written as
- US 12,697,791 B2 · US12697791 · 12697791
Abstract
The present disclosure concerns a molding apparatus including: a first thermally conductive flange and a second thermally conductive flange, said first and second thermally conductive flanges delimiting a cavity configured to receive thermoplastic pre-impregnated textiles, a mold thermally conductive and thermoregulated by a heat transfer fluid—comprising an upper impression and a lower impression, said upper and lower impressions being configured to receive said first and second thermally conductive flanges.
The opening of the abstract. The full text is in the PDF.
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Patent office website: United States Patent and Trademark Office (USPTO)
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