United States
US 12,697,808 B2
Surface modification of solder paste stencils
US 12,697,808 B2 is a granted patent from the United States Patent and Trademark Office (USPTO), dated 2026-08-04. Applicant: NEWTECH LLC. Its PDF downloads from this page without an account, up to 5 a day.
- Applicant
- NEWTECH LLC
- Inventors
- Steven Martin Johnson; Fraser Murray Shaw
- Publication date
- 2026-08-04
- Filing date
- 2022-08-25
- Document type
- B2 Granted patent
- Also written as
- US 12,697,808 B2 · US12697808 · 12697808
Abstract
The present disclosure relates to surface modification of solder paste stencils to provide improved adhesion of a functional coating. The disclosed surface modifications include laser structuring, plasma treatments, and primers. Methods of using the solder paste stencils are further disclosed.
The opening of the abstract. The full text is in the PDF.
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Patent office website: United States Patent and Trademark Office (USPTO)
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