United States
US 12,697,814 B2
Head module
US 12,697,814 B2 is a granted patent from the United States Patent and Trademark Office (USPTO), dated 2026-08-04. Applicant: BROTHER KOGYO KABUSHIKI KAISHA. Its PDF downloads from this page without an account, up to 5 a day.
- Applicant
- BROTHER KOGYO KABUSHIKI KAISHA
- Inventors
- Itsuki MORIMOTO; Yuki KAWAMURA
- Publication date
- 2026-08-04
- Filing date
- 2024-03-20
- Document type
- B2 Granted patent
- Also written as
- US 12,697,814 B2 · US12697814 · 12697814
Abstract
A head module includes: a head chip having an actuator, a channel member having a channel deformable by the actuator, and a support made of metal and supporting the channel member, a heater assembly; and a heat conductor. The heat conductor has a first contacting part in thermal contact with the support, and a second contacting part in thermal contact with the heater assembly and the actuator.
The opening of the abstract. The full text is in the PDF.
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Patent office website: United States Patent and Trademark Office (USPTO)
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